• 200G QSFP56 Direct Attach Cable
  • 200G QSFP56 Direct Attach Cable
  • 200G QSFP56 Direct Attach Cable
  • 200G QSFP56 Direct Attach Cable
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200G QSFP56 Direct Attach Cable

  • 200G QSFP-DD DAC 1M
  • QSFP56
  • 200G
  • <0.5W
200G QSFP56 Direct Attach Cable (DAC) is a high-speed, low-power, and low-latency copper interconnect solution designed for 200Gbps data transmission. Utilizing QSFP56 form factor and PAM4 modulation technology, it is widely used in data centers, cloud computing, high-performance computing (HPC), and AI networking environments for short-reach connections.

Specification

Part NumberESCRDT11-M01CCable Length0.5m~3m
Form FactorQSFP-56Power Consumption<0.5W
Wire AWG28~30AWGJacket MaterialPVC
Case Temperature(℃)0℃  to +70℃Application200G Ethernet

Product Features

  • Compatible with IEEE 802.3bj and IEEE 802.3cd

  • Supports aggregate data rates of 200Gbps(PAM4)

  • Optimized construction to minimize insertion loss and cross talk

  • Pull-to-release slide latch design

  • 26AWG through 30AWG cable

  • Straight and break out assembly configurations available

  • Customized cable braid termination limits EMI radiation

  • Customizable EEPROM mapping for cable signature

  • RoHS omplia


DAC


Product Highlights

  • Supports 200Gbps high-speed data transmission for next-generation data centers

  • Adopts PAM4 modulation technology for higher transmission efficiency

  • Low power consumption and ultra-low latency reduce operating costs

  • More cost-effective compared with optical transceiver solutions

  • Plug-and-play design for easy deployment and maintenance

  • Excellent EMI performance and signal integrity

  • Compliant with IEEE 802.3 and InfiniBand HDR standards

  • Ideal for short-reach high-speed interconnections 


Application

  • Short-reach interconnects in hyperscale data centers

  • Top-of-Rack (ToR) switch interconnections in data centers

  • Cloud computing network infrastructure

  • AI/GPU cluster networking

  • High-Performance Computing (HPC) systems

  • High-speed connections between servers and switches

  • Storage Area Networks (SAN)


Rigorous Industrial Product Testing

ESOPTIC is equipped with a comprehensive range of professional testing equipment designed to assess various parameters of optical products. 

This ensures the highest performance, quality, and stability of optical transmission in all of our products.

200G


Product packaging specification

Packing of  Direct Attach Copper products

  • Put DAC module into electrostatic bag (note module direction) and label.

  • The bottom, surface and side of the carton are filled with one piece of anti-static foam to protect the product.

  • According to the packing quantity requirements, put the products packed in anti-static ziplock bags into packaging cartons.

  • The space left in the trunk must be filled with anti-static foam to ensure that it will not be damaged in transit.

  • The outer case label is attached to the side position of the outer case.Label the outer case after sealing.

  • At the time of delivery, the entire outer box should be wrapped with at least 4 layers of wrapping film protection.

      ※The space in the box and the space in the mantissa box shall be filled with foam.


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