• 800Gbase OSFP SR8 PAM4 Transceiver Module
  • 800Gbase OSFP SR8 PAM4 Transceiver Module
  • 800Gbase OSFP SR8 PAM4 Transceiver Module
  • 800Gbase OSFP SR8 PAM4 Transceiver Module
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800Gbase OSFP SR8 PAM4 Transceiver Module

  • 800G OSFP 850nm SR8 50M
  • OSFP
  • 800G
  • 2x MPO-12(APC)&MPO-16(APC)
  • <16W
  • Multi-Mode Fiber(MMF)
Ideal for data centers and AI applications, this ultra-high-speed optical module delivers 800Gbps performance with advanced PAM4 modulation. Built with cutting-edge R&D and robust production capabilities, it supports seamless scalability.

Specification

Part NumberESXWHM85-M50CVendor NameESOPTIC
Form FactorOSFPDistance50m
Wavelength850nmConnector2x MPO-12(APC) & MPO-16(APC)
ReceiverPINTransmitterVCSEL
Power Consumption<16WMediaMulti-Mode Fiber(MMF)
Case Temperature(℃)C: 0℃  to +70℃Application800G Base Ethernet

Product Features

  • Data rate up to 850Gbps (8xPAM4 53.125 GBd)

  • High speed I/O electrical interface (800GAUI-8)

  • Support 6 applications:

  • 800GBASE-SR8

  • 400GBASE-SR8

  • 200GBASE-SR8

  • 8x100CBASE-SR1

  • 2x400GBASE-SR4

  • 4x200GBASE-SR2

  • Compliant to OSFP MSA Rev5.0

  • Maximum link length of 30m on OM3 or 50m on OM4

  • 8x VCSEL arrays and 8x PIN PD arrays

  • Management interface:CMIS 5.2

  • +3.3V single power supply

    OSFP Module


    Product Highlights

    OSFP 800Gbase

    800Gbps Ultra-High Bandwidth

    Delivers 800Gbps maximum data rate via 8 parallel 100Gbps channels, meeting high-density data center bandwidth demands.
    OSFP SR8

    50M Short-Reach Stability

    850nm wavelength matches OM3/OM4 multimode fiber, ensuring stable 50m transmission with low signal loss.
    OSFP Module

    OSFP Compact Form Factor

    OSFP package enables higher port density on switches/routers, saving valuable data center rack space.
    OSFP 800Gbase

    Hot-Swap & Broad Compatibility

    Supports hot-swapping for easy maintenance; works seamlessly with standard OSFP-port network equipment.

    Application

    Hyperscale Data Centers

    The 800G OSFP 850nm SR8 50M module is designed for hyperscale data centers requiring ultra-high bandwidth. It provides seamless connectivity for core switches, enabling efficient handling of massive data volumes and supporting AI training, real-time analytics, and cloud applications.

    AI Training Clusters & GPU Networks

    Ideal for NVIDIA HGX/H100/H800 systems, GPU Pods, and ML training networks requiring high-speed interconnects.


    Quality Certifications

    OSFP SR8






    Part NumberData RateWavelengthOptical ConnectorConfigurationReachMax. Power
    Consumption
    800G OSFP SR8ESXWM(H)M85-S10C2x 400Gbps
    2x SR4
    850nm2x MPO-12(APC)
    MPO-16(APC)
    8x 100G-PAM4 Electrical to Dua
     4x 100G-PAM4 Optical Parallel
    30m@OM3
    50m@OM4
    16W
    800G OSFP DR8ESXWM(H)B31-S50C2x 400Gbps
    2x DR4
    1310nm2x MPO-12(APC)
    MPO-16(APC)
    8x 100G-PAM4 Electrical to Dua
     4x 100G-PAM4 Optical Parallel
    500m16W
    800G OSFP 2FR4ESXWLC31-K02C2x 400Gbps
    2x FR4
    1310nm2x deplex LC8x 100G-PAM4 Electrical to Dua
    4x 100G-PAM4 Optical
    2km16W


    FAQ

    Q1. Is the 800G OSFP SR8 compatible with NVIDIA/HuaWei/Cisco?

    A1:Yes. It is compatible with major vendors and supports custom coding for full interoperability.

    Q2. What is the power consumption?

    A2:Typical consumption is ≤16W, optimized for high-density racks.

    Q3. How far can the SR8 module transmit?

    A3:30m@OM3 and 50m@OM4

    Q4. Does it support CMIS 5.0/5.1?

    A4:Yes. Fully compliant with CMIS for advanced monitoring and host communication.

    Q5. Do you provide test reports?

    A5:Yes—BER, eye diagram, spectral test, optical power stability, and temperature cycling.


    Rigorous Industrial Product Testing

    ESOPTIC is equipped with a comprehensive range of professional testing equipment designed to assess various parameters of optical products. 

    This ensures the highest performance, quality, and stability of optical transmission in all of our products.

    OSFP Module


    Product packaging specification

    Packing of module products

    • Put the qualified products into the corresponding model blister box packaging.

    • The bottom, surface and side of the carton are filled with one piece of anti-static foam to protect the product.According to the requirements of the packing quantity, put the blister box box of the product into the packaging carton. If the space between the blister boxes is large, use a piece of anti-static foam to put it in the middle. The empty space in the end box must be filled with anti-static foam to ensure that it will not be damaged during transportation.

    • The outer case label is attached to the side position of the outer case,Label the outer case after sealing.

    • At the time of delivery, the entire outer box should be wrapped with at least 2 layers of wrapping film protection.

    OSFP 800Gbase

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