ESOPTIC at the 20th Beijing International Data Center Exhibition 2026
Accelerating AI-Driven Connectivity with Next-Generation Optical Interconnect Solutions
As the global data center industry continues to evolve toward higher bandwidth, lower latency, and AI-centric architectures, the 2026 20th Beijing International Data Center Exhibition once again became a major gathering point for industry innovators, infrastructure providers, and optical communication technology leaders.
At this year’s exhibition, ESOPTIC proudly showcased its latest portfolio of high-speed optical interconnect solutions at Booth 8A-H55, drawing significant attention from customers, partners, and industry professionals across the data center ecosystem.
High-Speed Optical Solutions Designed for the AI Era
Driven by the rapid expansion of AI computing clusters, cloud infrastructure, and hyperscale networking, demand for ultra-high-speed optical modules continues to accelerate. During the exhibition, ESOPTIC presented a comprehensive range of products tailored for next-generation data center deployments, including:
1.6T OSFP
800G OSFP
400G OSFP
400G QSFP-DD
400G QSFP112
200G QSFP56
100G QSFP28
40G QSFP
25G SFP28
10G SFP+
100G AOC
400G DAC
These products demonstrated ESOPTIC’s strong capabilities in high-density optical connectivity, power optimization, signal integrity, and scalable transmission architectures for AI and cloud networking environments.
Among the highlights, the 1.6T OSFP and 800G OSFP solutions attracted extensive interest from visitors exploring future-ready infrastructure for AI training clusters and next-generation Ethernet upgrades. The compact design, thermal performance, and transmission stability of these products became key discussion points throughout the event.
Booth 8A-H55: A Dynamic Exchange of Innovation and Collaboration
Throughout the exhibition, Booth 8A-H55 remained highly active, welcoming visitors from telecom operators, cloud service providers, system integrators, and enterprise networking sectors.
The ESOPTIC technical team engaged in in-depth discussions on:
AI data center interconnect trends
800G and 1.6T migration strategies
High-density cabling architectures
Optical module compatibility and interoperability
Future development of low-power high-speed optics
The exhibition provided an excellent platform not only for product demonstrations, but also for valuable face-to-face communication with global customers and industry partners.
Exhibition Highlights Summary
1. AI Infrastructure Driving Demand for Higher-Speed Optics
The rapid adoption of AI computing is reshaping data center architectures, significantly increasing demand for 800G and 1.6T optical interconnect technologies.
2. Growing Industry Focus on Power Efficiency
Visitors showed strong interest in low-power consumption designs, thermal optimization, and energy-efficient networking solutions for hyperscale environments.
3. Increasing Demand for Flexible Interconnect Solutions
Products such as 400G DAC and 100G AOC continued to gain attention for short-reach and high-density deployment scenarios.
4. Strong Global Interest in ESOPTIC High-Speed Portfolio
ESOPTIC’s comprehensive product lineup demonstrated its capability to support evolving customer requirements across cloud computing, AI networking, and large-scale data center applications.
Looking Ahead
The 2026 Beijing International Data Center Exhibition marked another important milestone for ESOPTIC in strengthening global industry connections and showcasing advanced optical communication technologies.
Moving forward, ESOPTIC will continue focusing on innovation, reliability, and high-performance optical interconnect solutions, helping customers build faster, smarter, and more energy-efficient data center networks for the AI era.
We sincerely thank every visitor, partner, and customer who stopped by Booth 8A-H55. We look forward to meeting you again at future global industry events.
